Product Description
1 Double components
2 Heat-curing organic silicon resin material
3 Has high-light transmittance, good heat-
Stability, small stress, and low hygroscopicity
4 Used for LED packaging
HOW TO USE
A: B=1: 1, uses planetary gravity agitator to mix them equality and then you can use it. Or it can be used after you remove the bubble in the condition of 10 mmHg vacuum under 45ºC. Please operate in dry and clear enviroment.
Attentions:
Some of materials, chemical, curing agent, plasticizer can control the gel's curing. There are including:
1 organotin and other metallorganic compound
2 sulphur, polysulfide, polysulfone and others
3 amine, polyester rubber and other ammoniac
4 phosphorig and other phosphorig-containing
5 Some flux residues
If any doubt that whether some kind of material would restrain the curing, we suggest a compatibility experiment test for the suitability. If the uncured packaging materials exist the surface of the curing ones,
Then it is incompatible and will restrain curing.
Package and Storage
1 The storage period is 6 months, and should be preserved in shade (above 25ºC) and keep it dry.
2 This product is nontoxic and non-dangerous cargo, can be transport as normal chemical.
3 Be careful of the leakage during transportation, both of A, B silicone should be seal up.
Item |
Technical Parameter |
Before curing (A componet) |
Appearance |
Colorless Transparent Liquid |
Viscosity mPa@s(25ºC) |
12000 |
Before curing (B componet) |
Appearance |
Colorless Transparent Liquid |
Viscosity mPa@s(25ºC) |
1800 |
Mix Ratio |
1:1 |
Mix Viscosity mPa.s(25ºC) |
4500 |
Typical Curing Condition |
80ºC×1h+150ºC×3h |
After curing |
Appearance |
High transparent resin material |
Hardness(ShoreD) |
60 |
Refractive Index(25ºC) |
1.54 |
Transmittance(%, 450 nm) |
>95 |