Product Description
Product Description
Thermal Pad is a thermally conductive, filled-polymer laminate, supplied on a reinforcing mesh for added electrical isolation, easy material handling and enhanced puncture, shear and tear resistance.
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are a pre-formed square or rectangle of solid material (often paraffin wax or silicone based) commonly found on the underside of heat sinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heat sink (usually made from aluminum or copper). Thermal pads and thermal compound are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact; They would not be needed between perfectly flat and smooth surfaces. Thermal pads are relatively firm at room temperature, but become soft and well able to fill gaps at higher temperatures.
Features
Thermal conductivity: 0.6 to 4.5 W/m-K
Flame rating: UL94-VO
Good thermal conductive capacity
Electrical isolating
Good mechanical and physical performance
Applications
Telecommunications
LED lighting
Computers and peripherals
Motor driver control
Mass storage module
Power conversion
Audited Supplier 
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