Silicone Advantages
√ Very low thermal resistance
√ Flow, wetting, adhesion and cure properties that can help speed and simplify processing
√ Excellent thermal stability - wide operating temperature range
√ Reliable performance under harsh conditions - resistance to thermal shock, oxidation, moisture and chemicals
√ Excellent electrical insulation (dielectric strength)
√ Excellent stress relief
Advanced Silicone Solutions can be designed to Adhesives & Sealants, CFPGs, Conformal Coatings, Encapsulants, Thermally Conductive Adhesives, Thermally Conductive Encapsulants, Thermally Conductive Gap Fillers and Thermally Conductive Compound
Anpin designes aboves Materials and offer Solutions to Electric Vehicles Applications below:
Solutions |
Part No. |
1 or 2 Part |
Thermal Conductivity |
Applications |
Thermal Management - Thermally Conductive Gap Filler |
AP8120-MG200 |
2 part (1:1 mix ratio) |
2.0 W/m-K |
Battery Packs |
Thermal Management - Thermally Conductive Gap Filler |
AP8120-MG360 |
2 part (1:1 mix ratio) |
3.6 W/m-K |
Battery Packs |
Thermal Management - Thermally Conductive Gap Filler |
AP8120-TP350 |
1 part |
3.5 W/m-K |
Battery Packs |
Thermal Management - Thermally Conductive Adhesive |
AP-607-W-321 |
1 part |
2.8 W/m-K |
Battery Packs |
Thermal Management - Thermally Conductive Adhesive |
AP-607-W-521 |
1 part |
1.8 W/m-K |
Battery Packs |
Solutions |
Part No. |
1 or 2 Part |
Tensile Strength |
Applications |
Assembly - RTV Adhesive, FIPG |
AP-753-W-221 |
1 part |
2.0 MPa |
Battery Packs |
Assembly - Heat Curable Adhesive, CIPG |
AP-907-G-88 |
1 part |
2.0 MPa |
Battery Packs |
Solutions |
Part No. |
1 or 2 Part |
Viscosity/mPa.s |
Thermal Conductivity |
Applications |
Connector - Thermally Conductive Encapsulant |
905-B-11 |
2 part (1:1 mix ratio) |
Part A: 1400
Part B: 1200 |
0.6 W/m-K |
Battery Packs |
Connector - RTV Adhesive |
AP-753-L-140 |
1 part |
Self-leveling |
/ |
Battery Packs |